Tailong Shi | Glass Panel Embedded | Young Scientist Award

Assoc.Prof. Dr. Tailong Shi, Southeast University, China.

Dr. Tailong Shi is a highly skilled packaging engineer with a strong academic and professional background in electrical and computer engineering. He holds a Ph.D. in Electrical and Computer Engineering from Georgia Institute of Technology, where he also contributed as a Graduate Research Assistant at the 3D Systems Packaging Research Center. His work focuses on advanced packaging technologies, including chip-package co-design, process optimization, and characterization of high-performance packages. With expertise in various fabrication methods, including glass packaging and micro-via technology, Tailong has demonstrated his innovation in mm-Wave applications and mobile packages.

Publication profile

Scopus

Education and Experience

Ph.D. in Electrical and Computer Engineering, Georgia Institute of Technology, 2020
M.S. in Electrical Engineering, Santa Clara University, 2014
B.Eng. in Information Engineering, Southeast University, 2012

Work Experience:

Packaging Engineer Intern, SiTime Corporation, 2018
Software Engineer Intern, Jiangsu Changdian Electronics Technology Co., 2011
Graduate Research Assistant, 3D Systems Packaging Research Center, Georgia Tech, 2016-2020

Suitability For The Award

Assoc.Prof.Dr. Tailong Shi is a highly suitable candidate for the Young Scientist Award due to his extensive research contributions in the field of electrical and computer engineering, particularly in the areas of chip-package co-design, process development, and packaging characterization. His expertise and innovative contributions demonstrate his leadership potential in advancing technology within his field.

Professional Development

Dr. Tailong Shi has continually honed his expertise through hands-on research and industry internships. His work has spanned diverse aspects of packaging design, fabrication, and process optimization, which has allowed him to lead projects on innovative packages such as ultra-thin Glass Panel Embedded (GPE) packages. He has collaborated with CMOS & MEMS design teams, coordinated reliability testing, and developed software to enhance production processes in the packaging industry. Tailong’s proficiency in multiple tools, including AutoCAD, HFSS, and Keysight ADS, allows him to tackle complex challenges in system integration and packaging design.

Research Focus

Dr. Tailong’s research primarily focuses on advanced packaging technologies for high-performance applications, particularly in mm-Wave systems and mobile devices. His work includes the design and fabrication of Glass Panel Embedded (GPE) packages, addressing issues like low-loss interconnections and warpage reduction. He has contributed significantly to the development of 2.5D and 3D packages, as well as Package-on-Package (PoP) systems. Tailong’s efforts in chip-package co-design have led to innovations in process optimization, such as glass-to-glass bonding and precise die placement, ensuring enhanced reliability and performance. 🧑‍🔬

Awards and Honors

Certified Software “Production Control System in Packaging Industry V1.0”, Jiangsu Changdian Electronics Technology Co., Ltd. (2012)
Research Excellence, Georgia Institute of Technology (2020)
Best Packaging Project, SiTime Corporation (2018)

Publications

“Study on Regulating the Residual Stress of Electroplated Cu by Manipulating the Nanotwin Directions”
“Residual Stress Control Based on Electroplated Metal Grain Characteristics in Panel-Level Glass Advanced Packaging”
“A Study on Glass Surface Activation Process to Enhance Glass-Metal Adhesion Strength in Glass Advanced Packaging”

Tailong Shi | Glass Panel Embedded | Young Scientist Award

Tailong Shi | Glass Panel Embedded | Young Scientist Award

Assoc.Prof. Dr. Tailong Shi, Southeast University, China.

Publication profile

Scopus

Education and Experience

Work Experience:

Suitability For The Award

Professional Development

Research Focus

Awards and Honors

Publications

“Study on Regulating the Residual Stress of Electroplated Cu by Manipulating the Nanotwin Directions”

“Residual Stress Control Based on Electroplated Metal Grain Characteristics in Panel-Level Glass Advanced Packaging”

“A Study on Glass Surface Activation Process to Enhance Glass-Metal Adhesion Strength in Glass Advanced Packaging”

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Assoc.Prof. Dr. Tailong Shi, Southeast University, China.

Publication profile

Education and Experience

Work Experience:

Suitability For The Award

Professional Development

Research Focus

Awards and Honors

Publications

“Study on Regulating the Residual Stress of Electroplated Cu by Manipulating the Nanotwin Directions”

“Residual Stress Control Based on Electroplated Metal Grain Characteristics in Panel-Level Glass Advanced Packaging”

“A Study on Glass Surface Activation Process to Enhance Glass-Metal Adhesion Strength in Glass Advanced Packaging”

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