Xuemei Wang’s research centers on understanding and improving the corrosion resistance of metallic materials in complex marine environments, with a particular focus on copper–nickel alloys and underwater welding technologies. Her work bridges materials science, electrochemistry, and mechanical engineering, aiming to enhance the durability and performance of metals used in marine and offshore applications. During her master’s studies at Qilu University of Technology, she investigated the corrosion resistance of EH40 steel underwater wet welded joints, resulting in two SCI-indexed publications and participation in three patent designs. Currently pursuing her Ph.D. in Materials Science and Engineering at Shanghai University, Wang’s doctoral research explores the local corrosion mechanisms of copper–nickel alloys using advanced filament electrode techniques, seeking to elucidate corrosion behavior under varying environmental and electrochemical conditions. Her ongoing studies have already produced four SCI papers and one EI-indexed paper, demonstrating her significant contribution to corrosion science and materials engineering. Beyond her academic achievements, her research holds strong industrial relevance, providing theoretical and experimental foundations for the development of corrosion-resistant materials critical to shipbuilding, offshore structures, and marine energy systems. By integrating surface analysis, experimental modeling, and advanced simulation methods, Wang adopts a comprehensive approach to studying localized corrosion phenomena at microstructural and electrochemical levels. Her work not only contributes to academic advancement but also supports global sustainability goals by promoting eco-friendly corrosion control strategies and improving material longevity in marine environments. Through her persistence, interdisciplinary vision, and commitment to innovation, Xuemei Wang continues to play a vital role in advancing corrosion science and developing practical solutions for marine materials engineering.